Loctite® TM OutputTM. Self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards. SI is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI applications include the bonding of various heat generating. Material System: ; Chemical System: Silicone; Material Properties (Nominal / Typical): ; Thermal Conductivity: 1 W/m-K ( BTU-ft/hr-ft²-F).
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The dielectric breakdown strength is For additional assistance with Loctite Silicone Adhesive, please contact Kraydenan authorized distributor of Henkel Loctite Adhesives. The specific gravity of Loctite Adhesive is 2.
Contact Request a Quote. An adhesive bond line of.
For bonding circuit board substrates, metallic heat sinks, and ceramic chips, Loctite is an ideal selection for an adhesive. Loctite Thermally Conductive Silicone Adhesive For bonding circuit board substrates, metallic heat sinks, and ceramic chips, Loctite is an ideal selection for an adhesive.
It is locfite that the bond lines reach these temperatures for their specified times.
This product should be stored in a dry location in its unopened container. The proper cure rate depends heavily on the composition, size, and geometry of the parts that are being bonded, as well as the type of oven that is being used.
This product offers low resistance to the flow of heat from the power device to the heat sink.
Loctite 5404 Technical Data Sheet
This silicone based adhesive was designed for applications that include bonding numerous different types of devices that generate heat to their corresponding heat sinks. Once the material loctie been removed, it should not be returned to its original container as contamination may occur.
If added storage or application information is required for Loctiteplease contact a Krayden Technical Representative. For additional technical data, please see the Loctite Technical Data Sheet. Repacking Pails into Semco Cartridges December 4, These suggested times exclude heat up rate. This product boosts shock absorbing and load bearing characteristics of the bond area, and has low resistance to the stream of heat that moves from power device to heat sink.
No more adhesive than is necessary to fill the bond should be applied to the heat sink or the part.
Loctite | Krayden
Fluxing of Solar Panel Interconnects November 30, This, in turn, helps the conductive filler maintain consistent dispersion within the adhesive matrix. Loctite Adhesive is a white to gray silicone adhesive paste designed to bond power devices lkctite their respective heat sinks.
This material combines high thermal conductivity and great electrical isolation. Loctite provides strong bonds for metal enclosures in electronics circuits as well as modules, power semiconductors, graphics processors and other heat generating devices to their heat sinks. When applying loctie dispensing this material, a method that eliminates air entrapment within the bond line should be used.